Samsung has unveiled its latest flagship smartphone chip, the Exynos 2600, marking a significant advancement as the first 2nm chip in the market. Promising enhanced AI, CPU, GPU, and camera capabilities, the chip aims to address the overheating and throttling problems of its predecessors. Utilizing Samsung Foundry’s 2nm GAA process, it offers up to 30% more power efficiency than the previous 3nm process used for the Exynos 2500. A notable innovation is the Heat Path Block (HPB) technology, which incorporates a High-Kappa Epoxy Molding Compound to improve heat dissipation by integrating a copper-based heat sink within the chip. This advancement is expected to reduce thermal resistance by 16%.
The Exynos 2600 features the Xclipse 960 GPU, likely based on AMD’s RDNA4 architecture, which doubles compute performance and enhances ray-tracing by 50% compared to its predecessor. It employs Exynos Neural Super Sampling (ENSS) to leverage AI for smoother gaming, reducing the GPU’s workload and heat production. Samsung’s 2nm process is comparable to TSMC’s latest 3nm node in transistor density, with optimized power consumption across all IP blocks.
Interestingly, the Exynos 2600 does not include a built-in 5G modem or other connectivity features like Bluetooth, Wi-Fi, and GPS, which will be part of a separate chip in the upcoming Galaxy S26 series. This separation simplifies the chip’s design, potentially reducing heat generation.
