Qualcomm has announced the dates for its Snapdragon Summit 2026, scheduled from September 22-24 in Maui, Hawaii. During this event, the company is anticipated to introduce its next-generation high-end chips, including the Snapdragon 8 Elite Gen 6 and the Snapdragon 8 Elite Gen 6 Pro, both reportedly built on TSMC’s 2nm process. The Snapdragon 8 Elite Gen 6 Pro, with a higher clock speed, is expected to power the Galaxy S27 and Galaxy Z Fold 9 series. Meanwhile, Samsung may equip the Galaxy S27 and S27+ with its Exynos 2700 chip, featuring SBS cooling, in most markets. The Snapdragon 8 Elite Gen 6 is rumored to offer an eight-core CPU up to 4.4GHz, an Adreno 845 GPU, and support for LPDDR5X DRAM. Its Pro variant could boast a CPU up to 5GHz, an Adreno 850 GPU, and support for LPDDR5X or LPDDR6 DRAM.
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