Shanghai-listed Biwin Storage Technology will invest 4.5 billion yuan (US$672 million) in the third phase of its advanced packaging and testing project in Dongguan, Guangdong, marking a push into wafer-level operations.
Advanced packaging push and capacity targets
The third-phase commitment alone exceeds the 3.09 billion yuan Biwin put into the first two phases combined. According to Biwin’s stock filing on Tuesday, the project, including the first two phases, has not yet generated mass production revenue as it remains in customer sampling, process verification and small-batch production.
The company estimated the facility’s monthly capacity would more than triple to 10,000 wafers by the end of 2027, a projection noted in the filing and in earlier investor meetings.
Background and existing operations
Biwin already operates a traditional memory and system-in-package (SiP) packaging base in Huizhou, Guangdong, where it sources chips from external suppliers. The move into the Dongguan facility represents a shift toward more sophisticated wafer-level technologies beyond its established module packaging business.
