Can 3D stacking help a Chinese AI chip start-up bypass US tech controls?

A Chinese AI chip start-up, led by industry veteran Wei Shaojun, has emerged from stealth mode, positioning itself as a formidable player in China’s AI computing sector. Dongfang Suanxin, the company headed by Wei and vice-president of the China Semiconductor Industry Association, has launched a corporate website and social media account, highlighting its ambition to build a self-reliant AI chip ecosystem amid US tech export controls. The company utilizes “software-defined chips” and “3D stacked near-memory computing” to deliver ultra-high-performance computing chips, relying entirely on a domestic supply chain. This approach aligns with a global trend in the post-Moore’s Law era, where semiconductor giants are turning to 3D chip architecture as traditional scaling reaches physical limits. The concept has gained popularity in China, especially after Huawei proposed the “Tau Scaling Law” in May, aiming for increased transistor density through 3D architectural innovation.