Apple is set to collaborate with Samsung to manufacture next-generation image sensor chips for future iPhone models at a facility in Texas. This move signifies a significant shift from Apple’s previous exclusive reliance on Sony. As part of a $600 billion investment in U.S. manufacturing, Apple announced the introduction of a groundbreaking chip-making technology at Samsung’s Austin fab. This technology, unprecedented globally, will enhance the power and performance of Apple products, including iPhones. The new chips are three-layer stacked image sensors, which promise higher pixel density and improved low-light performance by stacking sensor layers vertically. This architecture also facilitates faster readout speeds, reduced power consumption, and a higher dynamic range. The manufacturing process, not previously used at a commercial scale, will see Samsung’s System LSI division supply the sensors, with mass production handled by its foundry division. These sensors are anticipated to debut in the iPhone 18 lineup next year, with preparations for initial production tests already underway at the Austin facility. This marks Apple’s first departure from Sony for iPhone image sensors, transitioning production to the United States. Currently, Sony produces the sensors in Japan, which are then delivered through TSMC.
Is Apple Shifting to US-Made iPhone Camera Sensors?
