Samsung is poised to introduce significant advancements with its upcoming Exynos 2800 chipset, focusing on enhancing on-device AI for mobile devices. The company is developing next-generation High Bandwidth Memory (HBM) packaging technology, which could address current limitations related to size, power, and thermal performance in mobile devices. This move aligns with Samsung’s strategy to reintegrate Exynos chipsets into its flagship series, as seen with the Exynos 2600 in the Galaxy S26 models. Future models, like the Galaxy S27, may continue this trend, potentially leading to an Exynos-exclusive flagship series. Additionally, Samsung is exploring the use of in-house GPU architecture and custom CPU cores for the Exynos 2800. Successfully overcoming these technical challenges would not only enhance mobile AI capabilities but also bolster Samsung’s memory business by positioning it as a leading supplier of HBM solutions for mobile devices.
Will Samsung’s Exynos 2800 revolutionize on-device AI?
