Samsung Electro-Mechanics, a division of the Samsung Group specializing in electronic components, is set to provide a vital component for Qualcomm’s inaugural AI accelerator. The company has commenced mass production of Flip-Chip Ball Grid Array (FC-BGA) substrates, crucial for high-end semiconductor chip packaging. These substrates are being manufactured for the Qualcomm AI200 at Samsung’s Busan facility in South Korea. This development signifies a notable enhancement in the collaboration between Qualcomm and Samsung, extending their partnership into the data center market. The FC-BGA substrates excel in connecting semiconductor chips to the main motherboard, offering superior electrical and thermal performance compared to traditional methods. The substrates for the AI200 are designed with 10 to 15 internal layers, optimized for AI inference tasks, and paired with energy-efficient LPDDR5 DRAM. Qualcomm’s AI200, announced in October 2025, incorporates custom Oryon CPU cores and a Hexagon NPU, and is anticipated to launch later this year.
Is Samsung Electro-Mechanics producing key components for Qualcomm’s AI accelerator?
