Samsung announced today that it has signed a $200 billion supply and production agreement with Broadcom, a strategic partnership that runs through 2030.
Samsung and Broadcom: a framework deal through 2030
The agreement covers the supply of memory chips and the fabrication of Broadcom-designed circuits using Samsung’s 2 nm process. Both companies say this strategic collaboration is formally set to extend through 2030.
What the deal includes: memory, 2 nm and advanced packaging
Beyond 2 nm wafer manufacturing, the contract also encompasses advanced packaging services and targets process technologies below 2 nm that Samsung says it has already commercialized. The advanced packaging technologies cited include 2.3D and 2.5D approaches, which are important levers for improving chip performance and power efficiency.
A focus on memory and high bandwidth
The provision of memory chips is an integral part of the agreement, with particular emphasis on high-bandwidth memory (HBM) solutions to support Broadcom’s high-performance and data-center-oriented products.
