A detailed leaked die shot offers the first clear look at Samsung’s Exynos 2700, the company’s next in-house flagship processor slated to debut in the Galaxy S27 and Galaxy S27+ in early 2027. The chip appears to combine a 10‑core CPU, an Xclipse 970 GPU, a large NPU and support for LPDDR6, and is reportedly fabricated on Samsung Foundry’s second‑generation 2nm process (SF2P).
Exynos 2700 architecture and key specs
The leaked floorplan shows an unconventional CPU layout: two Arm C2 Ultra prime cores and eight C2 Pro cores. The two C2 Ultra cores are reported at different clocks (4.24 GHz and 3.36 GHz). The eight C2 Pro cores are split into two clusters of four, clocked at 3.74 GHz and 2.88 GHz respectively. This design omits traditional efficiency cores and uses two prime CPU cores, a configuration noted as similar to Apple A‑series chips that also employ dual prime cores.
The chip includes a 24MB system‑level cache (SLC) that sits between CPU, GPU, NPU and main memory to accelerate data sharing, plus four 4MB L3 cache banks dedicated to the CPU. That yields a combined cache total of 40MB. By comparison, the leak notes this is close to the total cache of Xiaomi’s Xring O3, larger than the 24MB caches in MediaTek’s Dimensity 9500 and Qualcomm’s Snapdragon 8 Elite Gen 5, and smaller than the Apple A19 Pro’s 54MB.
A substantial portion of the die is occupied by the Xclipse 970 GPU, described as having eight workgroup processors (WGPs) with two compute units (CUs) each, for a total of 16 CUs. Rumors suggest the GPU may be based on AMD’s RDNA 5 architecture, which has not yet been officially launched by AMD. The GPU is presented as potentially among the most powerful mobile GPUs.
Support for memory is also highlighted: the design reportedly includes four 64‑bit LPDDR6 PHYs, indicating that the Galaxy S27 series could adopt LPDDR6 memory as an upgrade over recent LPDDR5X RAM in high‑end Galaxy devices.
There does not appear to be an integrated modem, echoing the Exynos 2600’s approach. Samsung will therefore use an external 5G modem for cellular connectivity, and Bluetooth, Wi‑Fi, GPS and NFC functions will likely be provided by an external chip.
The leak presents the Exynos 2700 as Samsung’s most advanced and powerful mobile chip to date. Rumors accompanying the floorplan suggest it could offer performance advantages over Qualcomm’s upcoming Snapdragon 8 Elite Gen 6 series in both CPU and GPU workloads, though those claims are presented as speculative in the leak.
